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SAMSUNG ELECTRONIC COMPONENTS

DRAM component collection

Inspect 7 DRAM source records in Samsung Chip. Review complete part numbers, package information and procurement next steps.

Inside the DRAM collection

7 source records are available here. Browse exact ordering codes and inspect their recorded attributes. This collection groups archive records; it does not establish interchangeability, lifecycle status or present stock.

Browse all DRAM parts →

Review before choosing

  1. Start with the complete approved part number or an engineering requirements brief.
  2. Compare package and recorded fields; resolve missing values with exact-device documentation.
  3. Keep technical approval separate from current price, lead time and batch acceptance.

Source catalog coverage

Manufacturers in these records

Samsung Semiconductor · 7 records

Recorded packages

96-TFBGA · 2 records

200-TFBGA · 2 records

54-TSOP (0.400", 10.16mm Width) · 2 records

78-FBGA · 1 records

Counts describe archive coverage only. Package labels are shown as recorded and require exact-device verification.

Example catalog records

Alphabetical examples from the source catalog; not recommendations or stock offers.

K4A4G085WE-BCRCDDR4-2400 4GB (512MX8)0.833NS CL78-FBGAK4B1G1646I-BYMA000DDR3-1866 1GB (64MX16)1.07NS CL196-TFBGAK4B4G1646E-BYK000DDR3-1600 4GB (256MX16)1.25NS CL96-TFBGAK4F6E3S4HM-MGCJLPDDR4 16Gb x32 3733 Mbps 1.1v200-TFBGAK4F8E304HB-MGCJLPDDR4 8Gb x32 3733 Mbps 1.1v 20200-TFBGAK4S510432D-UC75IC DRAM 512MBIT LVTTL 54TSOP II54-TSOP (0.400", 10.16mm Width)K4S510432D-UC75T00IC DRAM 512MBIT LVTTL 54TSOP II54-TSOP (0.400", 10.16mm Width)